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Early Patent Disclosure Notice: In connection with the development of an American National Standard, or other deliverable that requires use of patented inventions, the use of patented inventions shall be governed by the ANSI Patent Policy as adopted by ATIS and as set forth in the "Operating Procedures for ATIS Forums and Committees". For a full copy of the policy, please see Section 10, " Intellectual Property Rights Policy ".
Disclosure of relevant patented inventions at the earliest possible time in the development process is encouraged.
An opportunity will be provided for the members to identify or disclose patents that any member believes may be essential for the use of a standard under development. The response will be noted.
Neither the Committee, nor its Chair or Vice Chair, ensures the accuracy or completeness of any disclosure or whether any disclosure is of a patent that in fact may be essential for the use of standards under development.
Participants are reminded that participation in industry fora involves the potential for antitrust concerns or risks. To avoid such concerns and risks, participants should carefully observe the "Operating Procedures for ATIS Forums and Committees". In addition, sensitive discussion topics such as price, territories, specific contractual terms, etc., should be avoided. Any participant having concerns or questions regarding sensitive discussion topics should consult with their company's legal counsel, the Committee leadership, or ATIS legal counsel.
Further Patent Information
The list below is subject to change and includes those T1-related documents for which ATIS has received patent disclosure information. Please refer to the individual letters or statements themselves for the specific details of any one disclosure. You may contact Susan Carioti if you would like to obtain a copy of the letter/statements which were submitted. Neither ATIS or its members make any representations as to the validity or accuracy of information and/or claims contained within the individual letters or statements.
T1.104 |
AT&T |
T1.105 |
Bellcore, Lucent, NTI and Transwitch |
T1.105.01 |
NTI |
T1.105.02 |
Chip Logic |
T1.105.08 |
Fujitsu Limited |
T1.106 |
NTI |
T1.107 |
Verilink Corp. & Integrated Networks Corp. |
T1.221 |
AT&T |
T1.231 |
Acterna |
T1.301 |
AT&T |
T1.302 |
AT&T |
T1.303 |
AT&T |
T1.310 (withdrawn) |
AT&T |
T1.312 |
AT&T |
T1.403 |
Verilink Corp., AT&T, and Reliance Comm/Tec |
T1.404 |
Acterna |
T1.410 |
Acterna & Integrated Networks Corp. |
T1.413 |
Amati, AT&T Paradyne, Reliance Comm/Tec, and Siemens |
T1.416 |
Uses much of T1.646/StrataCom patent involved |
T1.416.01 |
StrataCom |
T1.416.02 |
StrataCom |
T1.416.03 |
StrataCom |
T1.416.04 |
StrataCom |
T1.418 |
Adtran, Spediant Systems |
T1.424 (Trial-Use) |
Texas Instruments |
T1.427 |
Actelis, Alcatel, Aware, Broadcom, Ciena Networks, Hatteras Networks, Infineon, and Spediant |
T1.518 |
NTIA/ITS |
T1.521 |
AT&T Corp. and Nortel |
T1.601 |
British Telecom |
T1.624 |
StrataCom |
T1.637 |
AT&T, Lucent Technologies, and StrataCom |
T1.640 |
StrataCom |
T1.646 |
Acterna, StrataCom |
T1.667 |
Telcordia |
T1.713 |
Revision/Consolidation of J-STD-007, -023 and -024 |
T1.715 |
Qualcomm/3GPP reference document |
T1.718 |
Ericsson |
T1.719 |
Ericsson |
T1.720 |
Ericsson |
T1.721 |
See J-STD-007 |
T1.723 |
Tantivy |
T1.801.03 |
NTIA/ITS |
T1.801.04 |
NTIA/ITS |
Technical Report No. 40 |
NTI |
Technical Report No. 75 |
Sarnoff Corp. |
JINI |
Sun Microsystems |
J-STD-007 |
Hughes, Philips, Matra Comm., Siemens, Nokia, PCSI, Inter Digital Tech. Corp., Motorola, NEC America, Ericsson, U S WEST, Hitachi, MCC Panasonic |
J-STD-008 |
Hughes, Siemens, PCSI, inter Digital Tech. Corp., Motorola, Ericsson, Qualcomm, U S WEST, Hitachi, Nokia, MCC Panasonic |
J-STD-009 |
Hughes, Siemens, Nokia, PCSI, Motorola, NEC America, Ericsson, U S WEST, Hitachi, Matra Comm., MCC Panasonic |
J-STD-010 |
Hughes, Siemens, Nokia, PCSI, inter Digital Tech. Corp., Motorola, NEC America, Ericsson, U S WEST, Hitachi, Matra Comm., Qualcomm, Inc., MCC Panasonic |
J-STD-011 |
Hughes, Siemens, Nokia, PCSI, Inter Digital Tech. Corp., Motorola, NEC America, Ericsson, U S WEST, Hitachi, MCC Panasonic |
J-STD-014 |
Hughes, Siemens, Nokia, PCSI, Inter Digital Tech. Corp., Motorola, NEC America, Ericsson, U S WEST, Hitachi, MCC Panasonic |
J-STD-014a |
Hughes, Siemens, Nokia, PCSI, Inter Digital Tech. Corp., Motorola, NEC America, Ericsson, U S WEST, Hitachi, MCC Panasonic |
J-STD-014b |
Hughes, Siemens, Nokia, PCSI, Inter Digital Tech. Corp., Motorola, NEC America, Ericsson, U S WEST, Hitachi, MCC Panasonic |
J-STD-018 |
Motorola |
J-STD-019 |
Motorola |
| 3GPP TS25.211 | AT&T Wireless |
| 3GPP TS43.318 | Kineto Wireless |
| 3GPP TS44.318 | Kineto Wireless |
| 3GPP TS26.346 | Digital Fountain |
